Heliatek is expanding its global presence in exhibiting at two major upcoming shows in the US and Europe.
The International Consumer Electronics Show (International CES) will take place from the 5th to the 8th of January 2017 in Las Vegas, Nevada (US). This show recognizes innovative concepts and products illustrating the various possibilities for applications of organic and printed electronics. Heliatek will exhibit with its strategic partner ENGIE, as part of the OpenInnov pavilion (Location: Sands Expo, Level 1 Hall G, Eureka Park Next – Booth 51720 to 51531). CES is taking place for the 50th time and is the most established launch pad for new innovation and technology being introduced to the market. Heliatek is presenting HeliaFilm in the context of Building integrated Organic Photovoltaic (BiOPV) urban fit solution.
At CES, Thibaud Le Séguillon, CEO of Heliatek, will also speak on the OE-A (Organic and Printed Electronics Association) conference track session “Printed Electronics: Key Enabling Technology for IoT”. He will present a variety of options for HeliaFilm enabling IoBT (Internet of Big Things) solutions.
HeliaFilm enables the distributed generation of electricity on industrial and commercial buildings. Through the Internet of Big Things these buildings will be smartly connected with devices, vehicles and other consumers in need of clean and affordable energy. HeliaFilm will allow power generation directly at the place of consumption.
Later in January Heliatek will exhibit for the second time at BAU in Munich (Germany) - 17th to 21st of January 2017. Heliatek will showcase demonstrators of several projects that have been realized with different partners throughout the last year. HeliaFilm was combined with building materials like fiber concrete, roof systems or steel façades. At BAU Heliatek will present its current projects and share the latest developments on its products.