Engineered Material Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce its DB-1588-3 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in Hall 2, stand E6 at the 28th European Photovoltaic Solar Energy Conference scheduled to take place 1 to 3 October, 2013 at Parc des Expositions Paris Nord Villipinte in Paris, France.
DB-1588-3 is designed to make contact from vias or other conductors on the solar cells to the back contact sheet. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to back contact metallizations during damp heat exposure. DB-1588-3 is designed to cure through the encapsulant lamination and cure process. This material is approximately 50% lower cost than standard silver filled adhesives and is lower cost than the current EMS DB-1588-2 product currently used for manufacturing back contact solar modules.
Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of conductive adhesives designed for photovoltaic applications.