02 September 2010
Henkel will display some of its most recent innovations in electrically conductive adhesive (ECA) technology at the European Photovoltaic Solar Energy Conference (EU PVSEC) taking place 6 – 10 September 2010 in Valencia, Spain.
These advances address the low stress, faster cure speeds and lower temperature curing requirements for modern thin-film and crystalline silicon (c-Si) module assembly by today’s photovoltaic (PV) manufacturing specialists. Reducing module stress is key to high yield production and module in-field reliability but materials such as solder and high-temperature cure ECAs can’t effectively deliver on these demands. So Henkel has developed two new ECAs.
Hysol Eccobond CE3103WLV is an electrically conductive adhesive designed for assembly of thin-film solar substrates that overcomes unstable contact resistance. Based on research that concluded electrochemical corrosion on copper and tin in elevated temperature and humidity conditions was the primary culprit of contact resistance instability, Henkel developed a new ECA to overcome this challenge. By introducing advanced corrosion inhibition characteristics into Hysol Eccobond CE3103WLV, the material enables stable electrical contact resistance between transparent conductive oxides (TCO) and tin terminations through 1000 hours of 85°C temperature at 85% relative humidity. This material enables manufacturers to employ a low temperature process, thus reducing energy consumption and device stress while maintaining electrical and adhesion performance.
Hysol Eccobond CA3556HF is an alternative to traditional solder connections used for c-Si solar modules; the traditional solder can be problematic for emerging thin, fragile solar cells. This material has been formulated to deliver low temperature curing at 150°C and a cure time of five seconds. It provides a bond between the Ag and SnPbAg coated tabs and the c-Si cells, delivering a stable and reliable electrical connection over the life of the module. Thin-film module manufacturers have also successfully incorporated Hysol Eccobond CA3556HF into processes that dictate low-stress, fast curing interconnection of cells and ribbons.
