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SunChemical_sun_and_sunflowerDuring the SNEC 6th (2012) International Photovoltaic Power Generation Conference and Exhibition on 16-18 May 2012 at the Shanghai New International Expo Centre (hall 2W1, booth 230) in Shanghai, China, Sun Chemical and its parent company, Dainippon Ink and Chemicals (DIC), will exhibit a range of products. They will showcase metallisation solutions for additive and subtractive processes, as well as module materials for use in the crystalline silicon (c-Si), thin-film, printed electronics and other emerging markets.

A wide range of metallisation pastes for the c-Si, thin-film and printed electronics markets will be on display. A variety of silver tabbing and aluminium backside pastes such as SunTronic Cellmet 437W Backside Aluminium paste and SunTronic Cellmet 451W Silver Tabbing Paste will also be shown for c-Si manufacturers of conventional and selective-emitter PV cells. The pastes are lead-, cadmium- and thallium-free, and have been optimised to be co-fireable with other metal pastes.

Sun Chemical's thin-film silver and graphite conductor pastes and inks are specifically designed for low-temperature processing on thin-film technologies, such as copper indium gallium diselenide (CIGS), cadmium telluride (CdTe) and organic photovoltaics (OPV).

Available for digital and screen printing, Sun Chemical's full range of alkali and solvent removable resists are formulated to withstand alkaline and acidic etchants for use in various subtractive printed electronic processes. The company also offers a range of insulators and dielectrics that can be used in screen print, roller coat, and inkjet applications. SunTronic Cellmet Insulator and Dielectric products can be used as permanent isolation layers in various PV cell configurations.

Sun Chemical and DIC will be co-exhibiting at SNEC to highlight their capability for providing customers material solutions for module manufacturing. DIC offers technical solutions for both frontsheet and backsheet applications and has many products under development.

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